02 / In Situ Metrology

Build the device.
Record the evidence.

Optical quality assurance, inside the assembly workflow.

Connect imaging, spectroscopy, and crystal-orientation measurements to the materials you select and the devices you build.

In situ optical QA

A build record
for every device.

01

Imaging

Bright-field · Dark-field

02

Characterisation

Photoluminescence · Differential reflectivity (absorption)

03

Orientation

Confocal Second Harmonic Generation (SHG) mapping available

Part of the build, not an afterthought

Assembly and metrology.
Connected.

Device quality is assessed during and after the build. Integrating optical QA into the instrument connects those observations to the crystal database and the assembly history.

For research teams and multi-user facilities, the result is a documented build rather than an isolated “hero” sample.

Imaging and Metrology Capabilities

Imaging and spectroscopy
in one workflow.

Multiple measurements. One quality record. No single measurement captures every aspect. We combine complementary imaging and spectroscopy to assess crystal morphology, defects, interface quality, and crystallographic orientation.

01

Bright-field imaging

Rapidly locate, classify and document 2D crystals using optical contrast, morphology and edge geometry.

02

Dark-field imaging

Reveal features that are difficult to see in bright field, including bubbles, wrinkles, contamination, tears and other scattering defects that can compromise interface and device quality.

03

Wide-field photoluminescence

Rapidly map optical emission across semiconducting crystals and heterostructures, assess spatial uniformity, and flag regions where emission is quenched or modified by defects, interfaces or stacking.

04

Wide-field
differential reflectivity

Automatically identifies crystal thickness of any material at high precision using wavelength-dependent constructive and destructive interference modelling. The same spectra also reveal excitonic resonances, material identity, and optical quality.

05

Confocal SHG mapping

Automatic twist-angle recognition and armchair / zigzag edge detection connect crystal-orientation information to the assembly workflow.

Traceability

Every build has a history.

The platform connects crystal morphology and metadata, the intended stack, machine-vision assembly, and optical QA.

  1. 01

    Starting crystals

    Morphology and metadata

  2. 02

    Device design

    Selected layers and arrangement

  3. 03

    Assembly

    Machine-vision-controlled build

  4. 04

    Optical QA

    A record linked to the device

What do you need to measure?

Tell us about your material system, device requirements, and optical characterisation workflow.

Talk metrology